| 摘要 |
PURPOSE:To seek to improve moisture resistance in electronic parts sealed with thermoplastic resin by forming synthetic resin in a projecting shape at a part of lead comb. CONSTITUTION:In electronic parts consisting of lead comb 4, an element 2, and synthetic resin, a projection 3 is made of synthetic resin at a part of the lead comb and is sealed. By formation of this resin projection 3, the cooling speed of the resin at the peripheral part of the lead comb can be equalized, so crack generation arising from stress concentration can be prevented. Hereby, the moisture resistance can be improved. |
