| 摘要 |
PURPOSE: To dissipate heat efficiently from a heat generating device without contacting a cooling fluid directly to a chip or a region fixed with the chip by providing a thermally conductive cooling hat for providing a space from a tinned inner heat conduction unit, and a bias means for pressing the inner heat conduction unit against an electronic circuit device. CONSTITUTION: The cooling module for an electronic circuit device comprises a finned inner heat conduction unit 14, a corresponding tinned cooling hat 40, and heat medium 29 exhibiting deformability at the boundary of the inner heat conduction unit and the boundary of corresponding fin of the cooling hat. A unique bias means 20 imparts a balanced force between the inner heat conduction unit 14 and the cooling hat 40 and presses the surface at the flat base 15 of the inner heat conduction unit against a corresponding chip 11 through the heat medium 29. The bias means 20 imparts a balanced load to the boundary of the chip 11 and the tinned inner heat conduction unit 14 and applies a uniform pressure thus producing a corresponding uniform heat flow through a deformable boundary. Preferably, the deformable boundary is an oily film of synthetic oil, for example, excellent in stability and having a relatively high thermal conductivity. |
