| 摘要 |
<p>PURPOSE:To prevent unevenness of the surface of an IC card by a method wherein a first card base material on which an opening part of an IC module is formed and a second card base material prepared by thermal fusion of a transparent oversheet material and a core material are provided, and are bonded with an adhesive hardening at a low temperature. CONSTITUTION:An oversheet material 1 and a core material 3 are pinched between stainless plates or the like and are thermally pressured to form a second card base material 13. They are thermally so welded by fusion as to be uncapable of being peeled off and besides, unevenness due to a character and a figure 2 is absorbed. When the core material 4 and the oversheet material 1' are welded by fusion, a surface of the oversheet material 1' is flattened and besides, a surface of the core material 4 is coarsened. Then, an opening part 7 for insertion of an IC module 8 is worked by cutting with a drill 6 to form a first card base material 12. A minute amount of an adhesive 11' is applied on a bottom face of the opening part 7, and the IC module 8 is inserted. A window 10 into which a connection terminal 9 is fitted is formed to the second card base material 13 by press working. The first card base material 12 and the second card base material 13 on which the adhesive 11 is applied are laminated, and are pressured at a low temperature to harden the adhesives 11 and 11'.</p> |
