| 摘要 |
<p>PURPOSE:To house the maximum number of LSIs and input-output wires in the minimum space inside a device to shorten bonding time by a method wherein optical LSIs are connected with each other with lead wires in a Y and an X axis, and optical fibers are connected between an input and an output and the optical LSIs in a Z axis. CONSTITUTION:A function, which receives light rays from an optical fiber 1, and another function, which sends out light rays to the optical fiber 1, are provided in a direction of a Z axis at a right angle with a plane of an optical SLI 4, and a signal sending and receiving function of a lead wire is provided in a direction of the plane or in an X-Y direction. The lead wires are packaged forming flat cables 2. As mentioned above, an empty space inside the device efficiently houses the above components, and the maximum number of the input-output wires can be housed in the minimum space. The optical LSI 4 is provided with the following: a glass plate 11 for inputting or outputting an optical signal; a photodiode 13 converting the inputted optical signal into an electrical signal; an LED 12 converting an electrical signal into an optical signal; a wiring 16 connecting an electrical signal in directions of an X axis and a Y axis; a power source 14; and a ground 15. An IC layer is laminated under an LED 12 and a photodiode 13.</p> |
