| 摘要 |
PURPOSE:To enable the multi-terminal connection of two or more semiconductor chips and the formation of a resin mold packaging without deteriorating an element property by a method wherein a deformation preventive resin is filled between a primary face of a first semiconductor chip and a primary face of a second semiconductor chip. CONSTITUTION:Two or more semiconductor chips 3 and 4 and a lead frame 5 are provided inside a single package 2 formed of a molding resin 1, and primary faces of the chip 3 and another second semiconductor chip 4 are arranged to face each other. And, an electrode terminal 3b of the chip 3 and an electrode terminal 4b of the chip 4 are overlapped above and below and connected through a reflow method. And, a deformation preventive resin 13 other than the molding resin 1 is previously filled into an interface between the primary faces 3a and 4a of the chips 3 and 4 through a dispenser or the like and set by heating. Next, a resin provided with the following properties is used as the resin 13. The properties are as follows: it is so excellent in fluidity as to flow easily into between the chips before it is set; it is a non-solvent type resin small in a setting shrinkage factor after it is set; it has a thermal expansion coefficient nearly equal to that of a soldering material; and it has a solid-state property which withstands sufficiently a resin injecting pressure of a resin 1. It is preferable that an epoxy resin, which a filler is mixed into, is used as the resin which satisfies the above conditions. |
