| 摘要 |
<p>PURPOSE:To prevent a solder from rising up and a soldered joint from deteriorating in strength even if the mounting or dismounting of an integrated circuit is performed due to a design change by a method wherein the whole lead is subjected to a nickel plating, and only the tip of the lead, which a solder adheres to, is Au-plated. CONSTITUTION:After the whole lead 3s have been Ni-plated, the lead 3s are brazed to connecting pad 33s, which are provided to a package of an integrated circuit 2, to be fixed to the integrated circuit 33s. Next, the integrated circuit 2 is positioned to a first cut-out 30a formed on a Au plating jig 30 which is formed of a plastic resin, whereby only the tips (where solder adheres actually) of the lead 3s are made to protrude from through-holes 31' of a mask 31. And, when the integrated circuit 2 package is positioned to a Au plating tank 32 which contains a molten electroless plating Au, only the tips of the lead 3s are Au-plated.</p> |
