| 摘要 |
PURPOSE:To minimize the alignment errors by a method wherein the marks on a semiconductor substrate both in X and Y directions are formed respectively on the X and Y axes assuming the center of the exposure region as an origin to measure the alignment errors in respective X and Y directions of an aligner. CONSTITUTION:Marks 101,102 to measure the alignment errors in respective X and Y directions are arranged on the central position of an exposure region. After exposure and development, the overlapped errors in the marks 101, 102 are measured to input the data in the aligner as the alignment correction amount for making the alignment errors + or -0. Since the conventional marks are arranged on the peripheral parts of the exposure region both in X and Y directions, even if the alignment errors in the position are corrected to + or -0 both in X and Y directions, the other exposure regions are subjected to notable effect of lens distortion resulting in new alignment errors. However, in this invention, said marks 101, 102 being arranged on the central position of the exposure region, the alignment errors due to the lens distortion in the other exposure regions can be restricted to the minimum. |
