| 摘要 |
<p>PURPOSE:To reduce a stress to be exerted on an insulating substrate and a heat sink and to prevent a warp and a crack by a method wherein the insulating substrate is attached to the heat sink by using a flexible adhesive. CONSTITUTION:Semiconductor elements 4 and external electrodes 5 are soldered to required parts on both the surface and the rear of an insulating substrate 3 which insulates a heat sink 2 from a circuit of a semiconductor device; in order to attach the heat sink 2, a metal such as Mo-Mn or the like is put together by baking in advance; after that, a metal such as Ni or the like is plated; the insulating substrate 3 is attached to the heat sink 2 by using a flexible adhesive 7. As a result, since the heat sink 2 and the insulating substrate 3 whose coefficient of linear expansion differs from each other are bonded by using the flexible silicone rubber-based adhesive 7, a thermal stress which is caused during a cooling operation at room temperature is absorbed by the flexible silicone-rubber-based adhesive 7. Accordingly, it is possible to prevent the semiconductor device from being warped or the semiconductor substrate from being cracked.</p> |
