| 摘要 |
<p>PURPOSE: To obtian an electric and electronic element fitting board capable of densificating chips, by providing a plurality of connecting routes for connecting an interconnection wiring part and electric elements electrically, and penetrating a support substance. CONSTITUTION: An element fitting board makes a separated board by forming a thin interconnection wiring film on one side of a board and fitting chips to the other side, and the board 30 has a support substance 32 and the thin interconnection wiring film 34. Interconnection wiring is composed of a group of transmitting wirings strips, and chips, cards, circuit boards etc., in multiple chip modules are mutually connected by wirings, and a large number of access pads 36 are provided in the interconnection wiring film. The access pads reach contact zones between the interconnection wiring film and the supporting substance by the aid of struts stretching from the bottom surface of the interconnection wiring film, and are connected to chips indirectly. The struts connected the supporting substance 32 electrically to connecting routes 38 which penetrate in the upward and downward direction. And the interconnection wring film is electrically connected to the bonding sites of the chips by the connecting routes. Accordingly, it becomes possible to make the pads themselves smaller, and the densification of the chips becomes feasible.</p> |
