| 摘要 |
<p>PURPOSE: To harden in a short time at a low temperature possible, by emitting light of a wavelength 200-600nm on an adhesive agent before fixing a component onto a circuit board, and making activation in such a degree as being able to maintain the initial stickness of the adhesive agent and being unable to form a film on the surface. CONSTITUTION: When gluing an SMD onto a circuit board, an adhesive film 3 is applied onto the circuit board 1 having a contact terminal 2, and chemical rays (UV or visible light) in a wavelength range of 200-600nm are emitted on the adhesive film 3 to activate it by a strength and for a time in a degree of being able to maintain a desired stickness and being unable to form a film on the surface of the adhesive agent. Next, a component 4 with an electrode 5 is put on the circuit board 1 by adjusting it to the activated adhesive film 3 and the contact terminal 2. After the adhesive film 3 is heated at a temperature of 60-140 deg.C with an infrared heater, the electric contact between the terminal of the component 4 and a printed wiring 2 is soldered in a wave or drag solder bath. As the result, quick activation free from problems becomes feasible, and it becomes possible to achieve perfect hardening at a low temperature in a short time.</p> |
