| 摘要 |
PURPOSE:To obtain a ceramic package in which wiring connection is conducted smoothly without contact with the ceramic body of a ceramic package during a bonding work by forming a surface so disposed as to have an oblique descending toward a semiconductor chip on the body. CONSTITUTION:Since the surface of the ceramic body 1 of a semiconductor integrated circuit device having wirings 8 has an oblique descending toward a semiconductor chip 2, in case of connecting bonding wirings 5 to the wirings 8, a stage for placing the body 1 is so inclined as to push a bonding tool 10 perpendicularly to the surface thereby to push the tool to the wirings 8, thereby connecting the wirings 5 thereto. In the case of connecting, the wirings 5 are extended perpendicularly to the surface of the chip 2, and even if the body 1 is inclined, it is not brought into contact with a metal sealing ring 4. |
