| 摘要 |
PURPOSE:To obtain a sufficient adhesion by allowing a lead frame to adhere to a solid solder by locally rubbing the surface of the frame with the solder by means of ultrasonic vibration, and rapidly melting the surface of the solder in contact with the frame by means of its frictional heat. CONSTITUTION:A predetermined quantity of solid solder 2 of pelletlike or sheetlike state is supplied to the pellet mounting position of a copper-base lead frame 1, a semiconductor pellet 3 is supplied thereon, an ultrasonic vibration is applied thereto by an ultrasonic bonding tool 4 at ambient temperature in a normal atmosphere while operating a pressure contact force thereat, and the frame 1 to the solder 2 and the solder 2 to the pellet 3 simultaneously adhere. Since the surface of the frame 1 is rapidly rubbed by the ultrasonic vibration corresponding to the vibration period of the tool 4 by the solder 2 in a short period of time, even if an oxide film or the like is formed on the surface of the frame 1, it is peeled to be removed and they can rigidly adhere. The frame 1 is heated rapidly only at the pellet mounting position for a short period of time. |
