发明名称 PACKAGE FOR AN ELECTROMAGNETIC RELAY
摘要 <p>A package for a surface mount type electromagnetic relay, comprising an inner casing for accommodating an electromagnetic relay main body therein; and an outer casing accommodating said inner casing therein in a mutually spaced relationship. Optionally, the space may be filled with heat insulating solid or liquid, or with a bonding agent. Because of the presence of the space between the inner and outer casings, the electromagnetic relay main body is protected from the heat when the electromagnetic relay is being mounted on the surface of a circuit board. Since the inner casing may consist of a normal package for an electromagnetic relay for general purpose, the electromagnetic relay main body as packaged in the inner casing may be used either as a surface mount type electromagnetic relay by using an outer casing therewith or as a normal electromagnetic relay without using any outer casing with the result that the manufacturing and stocking of electromagnetic relays for different applications may be simplified.</p>
申请公布号 EP0324439(A3) 申请公布日期 1990.01.17
申请号 EP19890100351 申请日期 1989.01.10
申请人 OMRON TATEISI ELECTRONICS CO. 发明人 SAGAWA, HIROYUKI
分类号 H01H1/58;H01H50/04;H05K3/34;H05K5/00;(IPC1-7):H01H50/14 主分类号 H01H1/58
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