| 发明名称 |
EPOXY RESIN COMPOSITION |
| 摘要 |
<p>An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.</p> |
| 申请公布号 |
EP0138209(B1) |
申请公布日期 |
1990.01.17 |
| 申请号 |
EP19840112269 |
申请日期 |
1984.10.12 |
| 申请人 |
HITACHI, LTD. |
发明人 |
TANAKA, ISAMU;KIKUCHI, HIROSHI;TOMIZAWA, AKIRA;OKA, HITOSHI |
| 分类号 |
B23K35/22;C08G59/50;C08L63/00;H05K3/00;H05K3/18;H05K3/28 |
主分类号 |
B23K35/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
