首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Temperature compensated springs
摘要
申请公布号
US3176509(A)
申请公布日期
1965.04.06
申请号
US19630291506
申请日期
1963.06.28
申请人
SCHMERTZ JOHN C
发明人
SCHMERTZ JOHN C.
分类号
G01L1/14;G01L1/22
主分类号
G01L1/14
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Mecanismo e méto o de afixaçao de bagagem auxiliar retrátril
Método de definiçao de endereço de ar condicionado de vários tipos e dispositivo de definiçao de endereço
Anordning for mottagning av radiosignaler
ACIERS A HAUTE TENEUR EN CARBONE, PROCEDE POUR LEUR PRODUCTION ET LEUR UTILISATION POUR DES PIECES D'USURE FABRIQUEES EN CET ACIER.
MANUFACTURING METHOD OF CIRCUIT COMPONENT
MANUFACTURE OF SEMICONDUCTOR LASER
DIODE
MANUFACTURE OF SEMICONDUCTOR DEVICE
INTEGRATED CIRCUIT
4:2:2 COMPONENT DECODING DEVICE
OFFERING METHOD FOR SPEECH RECORDING SERVICE
TRANSMISSION SYSTEM AND CIRCUIT DEVICE FOR THE SYSTEM AS WELL AS MOVING STATION
MICROSTRIP ANTENNA
THERMOSETTING RESIN COMPOSITION
IMAGE CONNECTION DEVICE
MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
MANUFACTURE OF SEMICONDUCTOR DEVICE
ROTARY SOLENOID
SURFACE MOUNT THERMISTOR
BACK LIGHT FOR LCD DISPLAY FOR RADIO CALL RECEIVER