| 摘要 |
<p>PURPOSE:To enhance reliability and reduction in thickness of a semiconductor device by providing a plurality of inner leads, and a platelike or filmlike insulating member to be secured to at least part of the leads, and placing a semiconductor pellet on a region surrounded by the leads. CONSTITUTION:A lead frame 13 employs an insulating plate 11 for placing a semiconductor pellet, and leads 12, 44 adhere at the rear faces of inner leads 12a, 44a to the edges of the front surface of the plate 11. Thus, since the leads 12a, 44a of the leads 12, 44 are connected through the plate 11 and supported to each other, no deformation occurs due to the application of an external force at the time of assembling. Further, the pellet 48 is placed on the plate 11, wire bonded, sheathed by a package 14, elements are disconnected from the frame 13, and the leads are then bent to obtain a desired semiconductor device.</p> |
