发明名称 ENAMELED WIRING BOARD HAVING HIGH HEAT DISSIPATING PROPERTIES
摘要 PURPOSE:To obtain an enameled wiring board having improved heat conductivity at a practical cost by doping glass of an enamel layer with a specific amount of one or more materials selected from a group consisting of AlN, diamond and SiC. CONSTITUTION:An enameled board has a metallic substrate coated with ceramics, and glass in the enamel layer contains 5 to 20% by weight of one or more materials selected from a group consisting of AlN, diamond and SiC. For example, if AlN is to be incorporated, crystallized glass frit and 5 to 20% by weight of AlN powder are introduced into a ball mill together with isopropyl alcohol. In the ball mill, they are wet ground and mixed until particle size becomes 10mum or less. Using this mixture as electrodepositing bath, migration electrodeposition is performed by using, as an electrode, a steel plate to be enameled which has been washed, degreased and plated with a metal such as nickel or cobalt. Finally, the steel plate thus enameled is dried and baked.
申请公布号 JPH0212888(A) 申请公布日期 1990.01.17
申请号 JP19880160638 申请日期 1988.06.30
申请人 FUJIKURA LTD 发明人 YAJIMA KIYOSHI;OKUYAMA HITOSHI;SUZUKI TAKAO;ITOU MASANORI;URUGA KENICHI
分类号 H05K1/05 主分类号 H05K1/05
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