| 摘要 |
PURPOSE:To obtain a hybrid integrated circuit device in which components can be placed by using solder on a thick film substrate by placing beforehand an aluminum disc on the conductor land of the substrate to be connected to the terminal of a metal stem, and connecting the terminal of the stem to the disc with Au wirings. CONSTITUTION:An IC pellet 2 and an aluminum disk 3 are placed on a conductor land with an adhesive on a thick film substrate 1, the pellet 2 is wire bonded to a pad on the substrate 1 by Au wirings 4 and covered with resin 5. Then, a chip capacitor 6 is placed on a solder, the substrate 1 placed with components adheres to a metal step 7, the terminal 8 of the stem 7 and the disk 3 placed on the land of the substrate 1 are wire bonded by heating the substrate 1 by Au wirings 9 and thermally pressbonding to be connected. Thereafter, it is covered with a metal cap, and sealed by a laser, thereby obtaining a hybrid integrated circuit device. |
