发明名称 METHOD FOR DETECTING TERMINATING POINT OF SEMICONDUCTOR MANUFACTURING PROCESS AND SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PURPOSE:To manufacture a semiconductor device to a uniformly finished state without receiving any influence from the variation produced in the course of the manufacturing process by detecting the terminating point of the process by recognizing the progress of the process by continuously detecting variations in the physical property and structure of a film to be produced while the film is processed. CONSTITUTION:An arithmetic operator 8 calculates transmittance or extinction coefficient by performing arithmetic operations on the intensity of light having a wavelength of 405nm detected by means of an incident light detector 5 and reflected light detector 6. A comparator 10 discriminates the continuation or stoppage of a process by comparing the transmittance or extinction coefficient calculated by the operator 8 with a terminating point reference value inputted from an input device 9. A control instruction outputting device 11 outputs a discriminated result of the comparator 10 to the heater controller of a hot plate as an instruction. Since terminating points of various processes performed on a film to be processed can be detected by recognizing the variation is the physical property and structure of the film in the course of manufacturing a semiconductor device in such way, the semiconductor device can be manufactured in a uniformly finished state without receiving any influence from the variations produced during the manufacturing process.
申请公布号 JPH0212909(A) 申请公布日期 1990.01.17
申请号 JP19880164541 申请日期 1988.06.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 KOYAMA TORU
分类号 G03F1/00;G03F1/68;H01L21/027;H01L21/30;H01L21/302;H01L21/3065 主分类号 G03F1/00
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