发明名称 MANUFACTURE OF CIRCUIT BOARD
摘要 PURPOSE:To prevent insulator from deteriorating due to an electrolytic corrosion at the time of application of voltage between wiring conductors on and in an insulating board by interposing nickel of substance having less transfer of components due to an electric field between copper of wiring conductor and the board. CONSTITUTION:An inner layer circuit conductor 2 is formed of metal copper foil on an insulating board 1. A metal nickel layer 3 is formed by nickel plating on the conductor 2. However, an insulating layer 4 made of an insulating base material must be provided between inner layer circuit conductor layers and between it and a board surface circuit conductor layer 5. Then, a hole to become a through hole is opened. A metal nickel plate 7 is formed by nickel plating on the inner wall 6 of the hole. Thus, an insulation deterioration can be effectively prevented not only on the board but between the conductor and the inner wall of the hole.
申请公布号 JPH0210889(A) 申请公布日期 1990.01.16
申请号 JP19880161921 申请日期 1988.06.29
申请人 HITACHI CHEM CO LTD 发明人 OUCHI TAKASHI;KAMIYAMA KOJI;KAWADA NOBUO
分类号 H05K3/46 主分类号 H05K3/46
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