Forced-convection, liquid-cooled, microchannel heat sinks

摘要

A microchannel heat sink used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow. The turbulent flow may be either developing or fully developed. The heat sink features a compensation heater surrounding the integrated circuit and heated at the same rate as the integrated circuit to thereby provide a more uniform temperature at the perimeter of the integrated circuit.