| 发明名称 |
Printed circuit board for electronics |
| 摘要 |
An easily automated and heat-stable semiconductor contacting system for linear and planar SMD components, particularly LED arrangements. SMD components are applied to a carrier film coated with interconnects. The interconnects are entirely or partly formed of solderable material for simpler contacting through melting. |
| 申请公布号 |
US4894751(A) |
申请公布日期 |
1990.01.16 |
| 申请号 |
US19880197602 |
申请日期 |
1988.05.20 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WEHNELT, ULRICH |
| 分类号 |
B32B15/08;H01L21/60;H01L23/498;H01L25/075;H01L33/00;H05K1/18;H05K3/32;H05K3/34 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 地址 |
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