| 摘要 |
<p>PURPOSE:To shorten the alignment time, and to improve throughput capacity by previously setting a reference point and a comparison point by two sensors. CONSTITUTION:The distance only of the specific multiple section of chip size is kept between a sensor section 1 and a sensor section 2 before a wafer 10 is introduced. A movable carriage 11 is scanned with movement in the scanning direction by recognition patterns so that all of the signal levels of the recognition patterns of three sensors 3-5 of the sensor 1 are brought to 1 first. When all of the signal levels of the recognition patterns of the sensors 3-5 are brought to 1, the sensor section 1 is positioned onto the intersection of a dicing line presently. The wafer 10 is turned so that all of the signal levels of recognition patterns are brought to 1 regarding the three sensors 6-8 of the sensor section. When the state in which all of the signal levels of the recognition patterns of the sensors 3-4 are brought to 1 is broken at that time, all of the signal levels of the recognition patterns of the sensors 6-8 are brought to 1, and the patterns are scanned, and the process is repeated until all of the signal levels of the recognition patterns of the sensors 3-8 are brought to 1.</p> |
