| 摘要 |
PURPOSE:To accurately align a plurality of inner layer plates, and to manufacture multilayer circuit boards in high productivity by inserting split eyelets or rivets at end hollow parts into aligning reference holes opened at predetermined positions of the plates and prepreg, calking the hollow parts, and pressure molding the whole. CONSTITUTION:After two inner layer plates 4 in which signal and power source wiring patterns are formed on both front and rear faces are superposed with three prepregs 5 disposed therebetween, they are aligned with copper split eyelets 9 or rivets 10. The eyelets or the rivets are respectively inserted into four reference holes opened at a predetermined interval at the peripheries of the plates 4, the prepregs 5, sequentially superposed while aligning, and the split end hollow parts protruding from the upper faces of the plates are calked. Then, after two prepregs 5 and a copper foil 6 are sequentially superposed on both side faces of the thus clamped laminate, it is heated and pressurized under predetermined conditions to be integrally molded to manufacture a 6-layer plate. |
