An electrical header assembly for a printed circuit board or the like comprises a housing of thermoplastic material having a mating portion and a conductor portion and a row of laterally spaced insert molded blade terminals of stamped sheet metal construction. The blade terminals have tails which are bent vertically in a secondary bending operation to provide vertical legs which are positioned and retained by laterally deflectable walls defining channels at the end of the conductor portion of the housing. The housing has a narrow peripheral groove which is defined by confronting faces of the mating and conductor portions of the housing and which is adapted for mounting the electrical header connector on an apertured panel wall.
