| 摘要 |
<p>PURPOSE:To realize a module for an IC cared easy in mass productivity and stable from a qualitative aspect by providing a step part having an almost vertical shape to the boundary part of the contact terminal part exposed to the outside of a lead frame and the part connected thereto and embedded in a seal resin. CONSTITUTION:In a metal lead frame 11, a step part having an almost vertical shape whose thickness is 1/4-3/4 that of the lead frame 11 is provided to the boundary part of a contact terminal 11a exposed to the outside and a part 11b embedded in a resin. Next, an IC chip 12 is fixed to the lead frame 11 by an adhesive 13 and, thereafter, the wiring pad 12a of the IC chip 12 is connected to the connection land 11d opposed to the part of the connection terminal 11a becoming an external terminal by a lead wire 14. Thereafter, the region other than the part of the contact terminal 11a exposed as the input/output terminal with the outside is sealed by a seal resin and cut into a predetermined dimension to obtain a separated module for an IC card.</p> |
