MODULE FOR IC CARD

摘要

PURPOSE:To extremely increase bending strength by arranging a terminal electrode to one surface of an IC ship and a thin metal plate to the other surface thereof. CONSTITUTION:A terminal electrode 6 is provided to one surface of an IC ship 3 and a recessed part 7a is formed to the mold resin 7 on the other surface of said chip 3 and a thin metal plate 12 is bonded to said recessed part 7a by an adhesive 13. The thickness of the thin plate 12 is set to 0.05-0.20mm. The whole is mounted to the recessed part 9a of a card material 9.