| 摘要 |
<p>PURPOSE: To manufacture an optical assembly easily at a relatively low cost by a structure wherein a cover separates two cavities for receiving a chip through a material in the cover for isolating the chip electrically and optically from each other. CONSTITUTION: Optoelectronic chips, i.e., laser diodes 92, 94, coupled through a waveguide 80 are mounted on a base 10 and surrounded by a cover 70. An optical fiber 18 is coupled optically with a V-groove 50 in the base 10 and secured in place by aligning the V-groove 78 of a silicon fixture 76 with a V-groove 50. The cover 70 is provided with two cavities 72, 74 in which the laser diodes 92, 94 are received when the cover 70 is applied to the base 10. The laser diodes 92, 94 are isolated electrically and optically from each other by means of a segment 77 of the cover 70.</p> |
