| 摘要 |
PURPOSE:To smoothly correspond to a bonding tool by increasing the lengths of a pair of sides parallel to the corner sides of the chip of a pad as approaching the corner of the chip. CONSTITUTION:A plurality of pads 2 arranged at a suitable interval inside the periphery of a chip 1 are increased in the lengths of a pair of sides parallel to the corner of the chip 1 toward the corner of the chip 1. When the two sides parallel to the side of the corner of the chip of the pads 2 are increased in length toward the corner, its bonding position can be so deviated as to satisfy a bonding tool so as to bond the pads 2 to wirings 4. That is, the degree of freedoms of bonding can be improved. Thus, the correspondence to the tool can be smoothened. |
