发明名称 LASER BEAM PROCESSING DEVICE
摘要 PURPOSE:To improve the quality of laser beam cutting and to miniaturize the processing device by forming the irradiation region of laser light to the length at which cutting is possible in the short side direction of an object to be cut and to the length shorter than the length of the short side direction in the long side direction. CONSTITUTION:The irradiation region A of the laser light to a fuse 11 is set at the time of cutting the fuse 11, etc., by using the processing laser light 12. Namely, the region is so set as to have the length X at which the fuse 11 can be cut in the direction along the short side of the fuse and the length Y shorter than the length X in the direction along the long side. Since the length Y along the long side direction of the fuse 11 can be shortened in this way, the length l1 of the fuse 11 is shortened. The disposition area of the fuse part 11 is, therefore, reduced as a whole. Further, the generation of the uncut part is prevented, as the length X in the short side direction is determined as the cuttable length. The quality of the laser cutting is thus improved and the processing device is miniaturized.
申请公布号 JPH026091(A) 申请公布日期 1990.01.10
申请号 JP19880156473 申请日期 1988.06.23
申请人 MATSUSHITA ELECTRON CORP 发明人 TSUURA KATSUHIKO
分类号 B23K26/00;B23K26/08;B23K26/38;H01L21/3205;H01L21/82 主分类号 B23K26/00
代理机构 代理人
主权项
地址