| 摘要 |
<p>PURPOSE:To prevent the breakage of an IC chip caused by stress concentration occurring on a substrate at and around an insulating groove by a method wherein the insulating groove extending orthogonally to the longitudinal direction of a card base material is provided outside an area corresponding to an IC chip mounting area. CONSTITUTION:An insulating groove 22 extends orthogonally to the longitudinal direction of a card base material 30 on the slightly righthand side of the center of a substrate 12. Since an IC chip 17 is disposed on the slightly lefthand side of the center of the substrate 12, the insulating groove 22 is disposed out of an external terminal-side area corresponding to an area for mounting the IC chip 17. The IC card 10 in use is subjected to a bending action in the longitudinal direction of the card base material 30, whereby stress concentration occurs on the substrate 12 in the vicinity of the insulating groove 22 extending orthogonally to the longitudinal direction of the card base material. Since the insulating groove 22 is disposed outside of the external terminal-side area corresponding to the area for mounting the IC chip 17, the IC chip 17 can be prevented from the breakage caused by the stress concentration occurring on the substrate 12 in the vicinity of the insulating groove 22.</p> |
