| 摘要 |
<p>PURPOSE:To prevent the break of bonding wires due to a bending action in the longitudinal direction of a card base material by disposing the bonding wires orthogonally to the longitudinal direction of the card base material. CONSTITUTION:Electrode parts 25 provided on the lower surface of a pattern layer 15 are disposed from respective through holes 14 to the vicinity of an IC chip 17. The electrode parts 25 are connected to the IC chip 17 with bonding wires 18 disposed orthogonally to the longitudinal direction of a card base material 30. An IC card 10 in use is subjected to a longitudinally bending action as shown by an arrow R ; due to this longitudinally bending action, an IC module 11 is subjected to a similar bending action. In this case, since the bonding wires 18 are disposed orthogonally to the longitudinal direction of the card base material 30 shown by an arrow L, there is no possibility that the bonding wires 18 are broken due to the bending action to the IC card.</p> |
