| 摘要 |
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric material, such as ethyl cellulose, and a solvent, such as terpineol. The paste preferably includes frit material, such as one or more of alumina, cerium fluoride, bismuth oxide and silica. The paste may also include manganese and/or nickel. There is also disclosed a semi-conductor package made using the metallization paste. The package includes a conductive attachment area, conductive feed-through paths, conductive vias and a conductive external underside, all of which are formed using the metallization paste in various formulations. |
