发明名称 MOLDING DIE AND MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form integrally a resin in a runner part and resins in gate parts and to make it possible to separate a resin formed integrally with a lead frame from the lead frame by a method wherein the runner and the gates are connected to each other and the runner is provided with second runners provided in such a way as to come into contact directly to the gate side of the inserting grooves of the lead frame. CONSTITUTION:Second runners 4, which are in parallel with a runner 1 and are connected with the runner 1 at both ends of the runners 4, are provided in contact directly to inserting grooves 5 of a lead frame. The runner 1, gates 2 and the runners 4 are coupled with one another. Therefore, when a molding resin is flowed in through the runner 1, the molding resins filled in the runner 1, the gates 2 and the runners 4 are formed firmly and integrally and no burr is generated on the sides of the lead frame after the end of a molding process unlike a conventional way. Thereby, when, the lead frame is taken out, the molding resin formed integrally with the lead frame can be reliably separated from the lead frame.
申请公布号 JPH025538(A) 申请公布日期 1990.01.10
申请号 JP19880156583 申请日期 1988.06.24
申请人 FUJITSU LTD;KYUSHU FUJITSU ELECTRON:KK 发明人 UDOUYAMA YOSHIHIRO;BOSHITA CHITOSHI
分类号 B29C45/02;B29C45/36;B29L31/34;H01L21/56 主分类号 B29C45/02
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