发明名称 THERMOPLASTIC METHACRYLIMIDE GROUP-CONTAINING RESIN COMPOSITION
摘要 PURPOSE:To provide a thermoplastic methacrylimide group-containing resin composition having improved weather resistance by adding a specific amount of a specified tetramethylpiperidine derivative to the resin. CONSTITUTION:The resin composition comprises (A) 100 pts.wt. of a methacrylimide group-containing polymer comprising A1: 5-100wt.% of an imide ring structure unit of formula I (R1 is H, 1-20C alkyl, etc.) and A2: 0-15wt.% of one or more kinds of monoethylenic unsaturated monomers, (B) 0.01-10 pts.wt., preferably 0.05-3 pts.wt., of a tetramethylpiperidine derivative (e.g., 4- benzoyloxy-2,6,6-tetramethylpiperidine) and, if necessary, (C) 0.01-5 pts.wt. of an UV absorbent comprising a triazole compound.
申请公布号 JPH021753(A) 申请公布日期 1990.01.08
申请号 JP19890052951 申请日期 1989.03.07
申请人 MITSUBISHI RAYON CO LTD 发明人 NISHIDA KOJI;WATANABE KANJI
分类号 C08K5/34;C08L33/24;C08L57/04 主分类号 C08K5/34
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