| 摘要 |
PURPOSE:To simplify a wiring on mother board by a method wherein through- holes are provided in an IC package substrate to make the pad location of an IC chip and the connection terminal location of the substrate different from each other. CONSTITUTION:Through-holes T1 and T2 are provided in a package substrate 2 and connected to a chip enable pad CE and the terminal Q'1 of the substrate 2 through wirings respectively. The through-holes T1 and T2 are connected to each other with a rear pattern 5. With this constitution, the chip enable pad CE can be connected to a chip enable terminal Q1 through the pattern 5. As a result, in the interconnection between IC package on a mother board, the connection between common connection terminals and the wiring for the chip enable terminal can be provided independently, so that the wiring on the mother board can be simplified. |
