| 摘要 |
PURPOSE: To minimize the possibilities that a micromodule might come off when a card is subject to a bending stress by arranging so that the edge part of a cavity formed in a card body covers the edge part of a connecting terminal for the micromodule. CONSTITUTION: A sheet 10a is not yet cut out and a sheet 10b has a cutout of almost such a size as to accommodate an integrated circuit chip and a wire for connecting the chip to the connecting terminal 16 of the card. A sheet 10c has a larger cutout than the cutout of the sheet 10b and a last sheet 10d has such a cutout as to overhang on the sheet 10c. Further, a micromodule 14 is joined to a cavity 12 formed by laminating these sheets. Then the front face of the connecting terminal 16 is present in the plane forming the upper face of the card 10 and an overhand part 26 wraps a part not covered by the metal of the connecting terminal 16 on an insulating substrate 18. Thus the possibilities are low that the micromodule 14 might come off, even when a bending stress is applied to the card 10. |
