发明名称 MULTI-DESIGN WAFER
摘要 PURPOSE: To economically manufacture a relatively small number of devices having many different designs or constitutions on a single wafer by providing one device for at least two die areas and a device which is different from at least one of devices in the other die area in a zone in at least one die area. CONSTITUTION: A reticle 1 has four areas 2, 3, 4, and 5 having the same size and unique mask layouts for four different devices are respectively written on the areas 2, 3, 4, and 5. When each zone of a wafer is exposed by using the reticle 1, four different desired circuits can be manufactured. Since the wafer is exposed through the reticle 1, four die areas are formed on the surface of the wafer having patterns demarcated by irradiating the surface of the wafer with light through the mask layouts 2, 3, 4, and 5. Since each mask area 2', 3', 4', and 5' constitutes a unique circuit, devices can be obtained as many as the quadruple of the number of the four different devices when the surface of the wafer is exposed by using the reticle 1.
申请公布号 JPH023221(A) 申请公布日期 1990.01.08
申请号 JP19880329515 申请日期 1988.12.28
申请人 LSI LOGIC CORP 发明人 DAKURASU BII BOIRU;SUTEIIBUN ESU CHIYAN;JIEEMUZU ESU KOFUOODO
分类号 H01L21/822;H01L21/027;H01L21/30;H01L27/04 主分类号 H01L21/822
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