| 摘要 |
PURPOSE: To obtain a large array printhead to be assembled accurately with a low cost by forming a plurality of sub-units having abutting flat side faces on both a channel plate wafer and a heating element plate wafer, aligning them and adhering them. CONSTITUTION: A heating element wafer 55 has slender V-shaped groove 66 in which a plurality of slender through slots 67 are etched from a wafer surface of an opposite side to a surface having heating elements to the wafer therethrough. The channel wafer and the heating element wafer are aligned with each other and adhered so that a surface 57 of slots 65 of the wafer 56 becomes flush with a surface 68 of slots 66 of the element wafer. Thus, the one surface 69 of the slots 67 of the wafer is automatically snugly matched to the one surface of the slots 64 of the channel wafer. Then, the adhered both the wafers are diced into complete printhead sub-units 54 along a broken line 59. The sub-units 54 are laterally aligned to form a page width printhead 63. |
