| 摘要 |
Process for forming a contact in relief on an aluminium pin of an integrated circuit, comprising the following steps: providing a conductive polycrystalline silicon layer (23) beneath the aluminium pin (21); locally removing the aluminium layer so as to reveal part of the surface of the polycrystalline silicon layer; establishing a connection with the polycrystalline silicon layer by means of a drop of conductive adhesive (30). …<IMAGE>… |
