| 摘要 |
An encapsulated assemblage and a process for making an encapsulated assemblage comprising: (a) silanizing a substrate thereby forming a silanized substrate; (b) coating said silanized substrate with at least one thin extruded coherent film forming a coated substrate, said film consisting essentially of: (1) about 75 to about 90 parts by weight of a blend of: (x) about 65 to about 75 parts by weight of a selectively hydrogenated two-block polymer wherein one polymer block is designated by A and a second polymer block is designated by B such that prior to hydrogenation, (x,i) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40 % by weight of the total block copolymer, and (x,ii) each B is a polymer block having a number average molecular weight in the range of from about 10,000 to about 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 60 % weight of the total block copolymer, and (y) about 25 to about 35 parts by weight of a selectively hydrogenated multiblock copolymer which contains at least two kinds of polymer blocks wherein one polymer block is designated by A and a second polymer block is designated by B such that: (y,i) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40 % by weight of the total block copolymer, and (y,ii) each B is a polymer midblock having a number average molecular weight in the range of from about 10,000 to about 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 10 % weight of the total block copolymer, and (2) about 9.5 to about 23.5 parts by weight of a hydrogenated alpha -methyl styrene polymer resin; (3) about 0.5 to about 1.5 parts by weight of a phenolic antioxidant, a UV absorber with benzotriazole functionality, and a UV absorber with hindered amine functionality; (c) applying a vacuum to the assemblage thereby forming a pressure gradient between said substrate and said film, and thereby vacuum laminating the assemblage; and (d) heating said vacuum laminated assemblage to a temperature greater than the softening point of said film and less than the melting point of solder and thereby heat sealing said assemblage. |
