| 摘要 |
<p>PURPOSE:To contrive a reduction in the possibility of failure in packaging by providing a plurality of electrodes on a lead frame, adhering a protective material to one side of the lead frame, thereby performing packaging, and removing the protective material after covering by a sealing resin. CONSTITUTION:A protective material 24 is adhered to one side 23 of a plurality of electrodes 22 provided on a lead frame 21, so as to cover at least a gap between the electrodes 22 and also electrode parts adjacent to the gap. An IC 27 is placed on and adhered to the other side 25 of the lead frame 21 by a die-bonding resin 26. An input/output pad of the IC 27 and the other side 25 of the lead frame 21 are connected to each other by conductor wires 28 of a wire bonding system. The part including the IC 27, the other side 25 and the conductor wires 28 is covered by a sealing resin 30, leaving the surface 29 of the protective material 24 uncovered, by a transfer molding method. The protective material 24 is then released. Since packaging is conducted with the protective material 24 left adhered, bending of the electrodes 22 does not occur, and the possibility of defects in packaging is reduced.</p> |
