HEATING METHOD OF SOLDERED CIRCUIT BOARD,申请号JP19880197609-传众专利搜索

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发明名称	HEATING METHOD OF SOLDERED CIRCUIT BOARD
摘要
申请公布号	JPH02396(A)	申请公布日期	1990.01.05
申请号	JP19880197609	申请日期	1988.08.08
申请人	FURUKAWA ELECTRIC CO LTD:THE;SENJU METAL IND CO LTD	发明人	KOBAYASHI YASUO;TSUKAGOSHI EIJI
分类号	B23K1/012;H05K3/34	主分类号	B23K1/012
代理机构		代理人
主权项
地址

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