发明名称 PRESS-FIT LEAD FRAME
摘要 <p>PURPOSE: To obtain an adapter and a socket which are functionally advanced by providing a frame and a circuit which includes conductive elements, holding the elements at specific positions by the frame, and making the respective elements include positions in the elements suitable to electrical connections of the elements with a board by coupling pins with the elements. CONSTITUTION: The adapter 10 is provided with a series of conductive copper- made elements 12, which extend from the outer peripheral part 14 to the inner peripheral part 16 of the adapter. The elements 12 are formed of electrically insulating materials 18, e.g. LCP or epoxy. Further, a hole 24 is provided which penetrates the adapter from the top surface 20 to the reverse surface 22 and is shielded by the elements 12 to some extent. A heat sink and a chip carrier 28 are arranged blow the level of the elements 12 at the inner peripheral part 16 so as to radiate heat from this chip when the chip 30 is located on the adapter 10 as shown by an arrow 32. Consequently, the adapter and socket can be obtained which are functionally advanced.</p>
申请公布号 JPH021151(A) 申请公布日期 1990.01.05
申请号 JP19880291017 申请日期 1988.11.17
申请人 ADVANCED INTERCONNECTION 发明人 JIEEMUZU BUI MAAFUII;MAIKERU JIEI MAAFUII
分类号 H01L23/12;H01L23/495;H01L23/498;H01L23/50;H01R33/76;H01R33/94;H01R33/945;H05K3/32;H05K7/10 主分类号 H01L23/12
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