HALBLEITERBAUELEMENT MIT ZUVERLAESSIGER BONDFLECKENSTRUKTUR.

摘要

A semiconductor device includes a semiconductor substrate in which one or more circuit elements are formed, a first insulating layer (13) covering the semiconductor substrate and having holes exposing the one or more circuit elements, a first metal layer (14) selectively deposited on the first insulating layer and contacting with the circuit element through the holes to form wirings, a second insulating layer (15) covering the first insulating layer and the first metal layer except for a limited portion of the first metal layer, and a second metal layer (16) formed on the limited portion of the first metal layer and extended to the second insulating layer on the first insulating layer, a conductive wire (17) being bonded on the extended portion of the second insulating layer.