| 发明名称 |
METHOD OF MAKING PACKAGED IC CHIP |
| 摘要 |
In the manufacture of a packaged IC chip, a lead frame segment (1) has a plurality of leads (4), the ends of which are connected to opposing rails (7, 3). After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover. |
| 申请公布号 |
DE3574433(D1) |
申请公布日期 |
1989.12.28 |
| 申请号 |
DE19853574433 |
申请日期 |
1985.04.10 |
| 申请人 |
GTE PRODUCTS CORPORATION |
发明人 |
GILDER, THOMAS G., JR.;O'DEAN, RAYMOND D. |
| 分类号 |
H01L23/50;H01L21/50;H01L21/56;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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