COMPRESSION BONDED TYPE SEMICONDUCTOR DEVICE,申请号JP19880153546-传众专利搜索

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发明名称	COMPRESSION BONDED TYPE SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH01321640(A)	申请公布日期	1989.12.27
申请号	JP19880153546	申请日期	1988.06.23
申请人	TOSHIBA CORP	发明人	YOSHIZAWA HIROYASU;KAWAMURA NORIYASU
分类号	H01L29/74;H01L21/52	主分类号	H01L29/74
代理机构		代理人
主权项
地址

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