| 摘要 |
PURPOSE:To obtain a multilayer printed wiring board, which is difficult to be subject to the effect of heat treatment, mechanical polishing treatment, etc., a dimensional change of which is reduced and dispersion on manufacture of which is also diminished and which has high density, by specifying an elongation percentage in the thickness of 0.070mm of copper foil used for an internal layer board. CONSTITUTION:In a multilayer printed wiring board in which a plurality of internal layer boards and external layer boards are changed into multilayers and molded through prepreg layers, the thickness of 0.070mm of copper foil employed for the internal layer boards is brought to 20-25%. When an elongation percentage in 0.070mm thickness is brought to 25% or more, the copper foil is extended completely by the application of force, and size is difficult to be controlled in machining such as polishing, plating, etc. Accordingly, the multilayer wiring board, which is difficult to be subject to the effect of heat treatment, mechanical treatment, etc., such as polishing, a dimensional change of which after molding is reduced and dispersion on manufacture of which is also diminished, is acquired. |
