| 摘要 |
PURPOSE:To prevent the generation of short circuits among wiring layers by repeating the printing of insulating paste and heat treatment in atmosphere or an oxidizing atmosphere several times in order to form an insulating layer when a sintered insulating layer is obtained. CONSTITUTION:Wiring layers 2 are printed previously onto an alumina baked substrate 1 by copper oxide paste, and dried. An insulating layer 3 not baked is screen-printed onto the substrate 1 by insulating paste, the dried substrate is thermally treated at 700-850 deg.C in air, and dust and waste thread 4 mixed at the time of printing are burnt and removed. An insulating layer 6 not baked is printed by insulating paste, and dried and thermally treated to form an insulating layer, and lastly wiring layers 2 are printed and dried by copper oxide paste. Accordingly, the printing of insulating paste is repeated several times in order to shape the insulating layers, but dust and waste thread mixed at the time of printing are thermally treated and burnt and gotten rid of in atmosphere or an oxidizing atmosphere at every printing, thus preventing the generation of short circuits among the wiring layers. |
