| 摘要 |
PURPOSE:To prevent false selection and thereby to increase the efficiency of inspection and the reliability thereof by providing a rejecting means to remove a substance to be inspected from an inspection stage or a marking means inside an X-ray inspecting apparatus shielded from the outside. CONSTITUTION:X-rays are applied from an X-ray application port 6 to a plurality of semiconductor devices 3 set on an inspection tray 2, and transmitted images thereof are picked up by an X-ray camera 5 to observe the state of occurrence of a blowhole. In the case when a product is judged to be faulty according to the state of formation of the blowhole on the occasion, a reject command is given. When the reject command is given, an adsorption nozzle 16 sucks in vacuum the semiconductor device 3 and transfers the device to an faulty product tray 18 to be removed. Besides, prescribed marking can be applied to the faulty semiconductor device 3 by giving a marking command. In this case, the removal of the faulty product is conducted in a state wherein the inspection tray 2 is taken outside. |
